Hanmi Semiconductor has officially announced an Investor Relations (IR) meeting scheduled for August 25, 2026, at 16:00 in Seoul. The event, organized as a group meeting sponsored by DS Investment & Securities, is intended for major domestic institutional investors to provide updates on the company’s current business operations and strategic direction.
The company intends to highlight several key growth drivers, including the expansion of facility investments for High Bandwidth Memory (HBM) 4 by domestic and international memory customers, which is driving increased demand for TC Bonders. Furthermore, Hanmi Semiconductor will discuss the strengthening of its 2.5D packaging equipment lineup for AI system semiconductors, featuring the 2.5D TC Bonder (40/120), FC Bonder 3.5, and HBF TC Bonder.
To address equipment shortages resulting from the surge in AI semiconductor investments, the company has acquired a new factory (Plant 8), the largest in its history. Additionally, the company announced its entry into the U.S. semiconductor market through the establishment of ‘HANMI USA’ to meet the growing demand for HBM TC Bonders and AI/Aerospace packaging equipment.