Hanmi Semiconductor announced on August 19, 2026, that it will participate in Citi’s 2026 Korea Investor Conference. The event is scheduled for August 27, 2026, in Seoul, and will consist of one-on-one and group meetings with major overseas institutional investors, sponsored by Citi Securities.
The company intends to highlight several strategic growth drivers during the sessions, including the response to increased facility investments in High Bandwidth Memory (HBM) 4 by domestic and international memory customers, which is driving demand for TC Bonders. Additionally, the company will discuss the strengthening of its 2.5D packaging equipment lineup for AI system semiconductors, featuring the 2.5D TC Bonder (40/120), FC Bonder 3.5, and HBF TC Bonder.
Furthermore, Hanmi Semiconductor will provide updates on its capacity expansion through the acquisition of its largest-ever new factory (Plant 8) to address equipment shortages resulting from AI semiconductor investment growth. The company also plans to discuss its entry into the U.S. semiconductor market via the establishment of ‘HANMI USA’ to meet demand for HBM TC Bonders and AI/Aerospace packaging equipment.