Hanmi Semiconductor has officially announced its participation in an Investor Relations (IR) event as part of the Nomura Securities ‘Tech Tour’. The event is scheduled for August 21, 2026, at 09:00 in Seoul, and will be conducted as a group meeting targeting major overseas institutional investors.
The company intends to discuss strategic growth initiatives, specifically focusing on the expansion of High Bandwidth Memory (HBM) 4 facility investments by domestic and international memory customers to meet the rising demand for TC Bonders. Furthermore, Hanmi Semiconductor will highlight the strengthening of its 2.5D packaging equipment lineup for AI system semiconductors, including the 2.5D TC Bonder (40/120), FC Bonder 3.5, and HBF TC Bonder.
To address equipment shortages resulting from increased AI semiconductor investments, the company has acquired a new factory (Plant 8), the largest in its history. Additionally, the company announced the establishment of ‘HANMI USA’ to penetrate the U.S. semiconductor market and respond to the demand for HBM TC Bonders and AI/Aerospace packaging equipment.