Hanmi Semiconductor has officially announced an Investor Relations (IR) meeting scheduled for August 31, 2026, at 15:00 in Seoul. The event is organized as part of the Raymond James Asia Tech Tour, hosted by CGSI Securities, and will be conducted as a group meeting targeting major overseas institutional investors.
The company intends to discuss several strategic growth drivers, including the expansion of facility investments for High Bandwidth Memory (HBM) 4 by domestic and international memory customers, which is driving demand for TC Bonders. Additionally, Hanmi Semiconductor will highlight its supply of 2.5D TC Bonders (40/120) and FC Bonders (3.5/75) to global foundry players expanding their AI system semiconductor investments, as well as increased demand for large-area MSVP (Singulation) equipment from global PCB companies investing in PLP and glass substrates.
To address equipment shortages resulting from the AI semiconductor boom, the company has acquired a new factory (Plant 8), the largest in its history. Furthermore, Hanmi Semiconductor announced the establishment of ‘HANMI USA’ to penetrate the U.S. semiconductor market and respond to the growing demand for HBM TC Bonders and AI/Aerospace packaging equipment.