Hanmi Semiconductor announced on September 18, 2026, that it will participate in the 2026 Asia Pacific Conference in Hong Kong on September 21, 2026. The event, sponsored by BofA Merrill Lynch, will consist of one-on-one and group meetings with major overseas institutional investors.
The company intends to highlight its expanding market dominance in TC Bonders, specifically focusing on increased supply for High Bandwidth Memory (HBM) 4/4E production. Additionally, Hanmi Semiconductor will discuss the supply of 2.5D TC Bonders (3 types) and FC Bonders (2 types) to foundry and OSAT customers, as well as the launch of Large-Area Singulation equipment (MSVP) to address demand for Panel Level Packaging and glass substrates.
To address the shortage of AI semiconductor equipment, the company is expanding production capacity through the construction of Plant 7 and the acquisition of a new Plant 8. Furthermore, Hanmi Semiconductor announced the establishment of ‘HANMI USA’ in October to enter the U.S. market, focusing on the supply of TC Bonders for AI packaging/HBM and EMI equipment for the aerospace sector.