Hanmi Semiconductor announced on September 14, 2026, that it will hold an Investor Relations (IR) session on September 15, 2026, hosted by CLSA Securities. The event will be conducted via group conference calls targeting major institutional investors from the United States, Europe, and Asia to provide updates on the company’s current business operations.
The IR session will focus on several strategic growth drivers, including the increased supply of TC Bonders for High Bandwidth Memory (HBM) 4 and 4e production, and the expansion of equipment supply for the AI system semiconductor market, specifically 2.5D TC Bonders (3 types) and FC Bonders (2 types). Additionally, the company will discuss the rising demand for large-area singulation equipment (MSVP) driven by global PCB manufacturers’ investments in PLP and glass substrates.
To address equipment shortages resulting from increased AI semiconductor capital expenditures, Hanmi Semiconductor highlighted the expansion of its production capacity through the acquisition of a new eighth factory. Furthermore, the company detailed its entry into the U.S. market via the establishment of ‘HANMI USA’ to supply TC Bonders for AI packaging/HBM and EMI equipment for the aerospace sector.