📌 Key Filing Highlights
- Event Type: Single Sales and Supply Agreement (Voluntary Disclosure)
- Contract Value: 24.48 billion KRW (~$18.23 million USD based on 1343 KRW/USD)
- Counterparty: Samsung Electro-Mechanics Co., Ltd.
- Key Equipment: Large-area micro SAW & VISION PLACEMENT (MSVP) for AI semiconductor substrate manufacturing
Filing Overview and Core Decision
Hanmi Semiconductor has officially disclosed the execution of a single sales and supply agreement with Samsung Electro-Mechanics Co., Ltd. The contract involves the supply of specialized equipment designed for the manufacturing of AI semiconductor substrates, specifically the Large-area micro SAW & VISION PLACEMENT (MSVP) system.
Detailed Filing Terms and Specifications
| Metric | Details |
|---|---|
| Contract Amount | 24,480,000,000 KRW (~$18.23 million USD) [Excluding VAT] |
| Ratio to Recent Revenue | 4.24% (Based on 2025 consolidated revenue of 576,684,619,527 KRW) |
| Counterparty | Samsung Electro-Mechanics Co., Ltd. |
| Supply Region | South Korea |
| Contract Period | October 2, 2026 to December 17, 2027 |
| Contract Date | October 2, 2026 (Date of Purchase Order receipt) |
| Down Payment / Advance | None |
Operational Purpose and Company Rationale
The purpose of this contract is the supply of Large-area micro SAW & VISION PLACEMENT (MSVP) equipment specifically utilized in the manufacturing process of AI semiconductor substrates. The company noted that the contract end date (delivery date) is subject to change based on mutual consultation with the customer.