Hanmi Semiconductor Announces Investor Relations (IR) Session for Q3 2026 Earnings and Strategic Growth Outlook

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DART Filing Β· Auto-translated

πŸ“… Filing Date: November 03, 2026 | πŸ”— Original Source: DART (Hanmi Semiconductor)

πŸ“Œ Key Filing Highlights

  • Event: Corporate Investor Relations (IR) Session hosted by Nomura Securities.
  • Date: November 6, 2026.
  • Primary Purpose: Presentation of Q3 2026 business performance and 2027 business outlook.
  • Strategic Focus: Expansion into Asian AI semiconductor packaging and U.S. semiconductor markets.

Filing Overview and Core Decision

Hanmi Semiconductor officially announced on November 3, 2026, that it will hold a Corporate Investor Relations (IR) session. The event is designed to communicate the company’s recent financial performance and future strategic direction to major global institutional investors via a group conference call hosted by Nomura Securities.

Detailed Filing Terms and Specifications

Metric Details
Date & Time November 6, 2026
Location / Method Nomura Securities Office / Group Conference Call
Target Participants Major global institutional investors
Sponsoring Institution Nomura Securities
Decision Date November 3, 2026

Detailed Agenda and Schedule

  • Core Content:
    • Review of Q3 2026 business performance and 2027 business outlook.
    • Strategies for securing mid-to-long-term growth engines.
    • Expansion of business domains into new semiconductor markets, specifically:
      • Entry into the Asian AI semiconductor packaging market.
      • Entry into the U.S. semiconductor market.
  • Detailed Session Schedule (Nov 6):
    • 09:00 AM: Session for major U.S. institutional investors.
    • 04:00 PM: Session for major European and Asian institutional investors.

Operational Purpose and Company Rationale

The company stated that the purpose of this IR session is to present the business performance for the third quarter of 2026 and to outline the company’s roadmap for securing mid-to-long-term growth drivers by expanding its business footprint into the Asian AI semiconductor packaging market and the United States semiconductor market.

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